Rofin Acquisition Targets Brittle-Material Laser Processing

April 1, 2014
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Cutting and drilling of glass, sapphire and semiconductor substrates—that’s the focus of the laser technology developed by FiLaser, Portland, OR, which has agreed to be acquired by Rofin-Sinar Technologies, Plymouth, MI. The transaction, which includes all intellectual property including trademarks and patents, was expected to close in March.
Industry-Related Terms: LASER
View Glossary of Metalforming Terms

 

See also: Rofin-Sinar, Inc.

Technologies: Cutting

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