Rofin Acquisition Targets Brittle-Material Laser Processing

April 1, 2014

Cutting and drilling of glass, sapphire and semiconductor substrates—that’s the focus of the laser technology developed by FiLaser, Portland, OR, which has agreed to be acquired by Rofin-Sinar Technologies, Plymouth, MI. The transaction, which includes all intellectual property including trademarks and patents, was expected to close in March.
Industry-Related Terms: LASER
View Glossary of Metalforming Terms


See also: Rofin-Sinar, Inc.

Technologies: Cutting


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