New Investment to Propel Aggressive Growth, Say Holo Officials

August 25, 2021

Metal-additive manufacturing (AM) company Holo has added two new investors in its Series B investment round, which the company plans to translate into aggressive growth in 2021 and 2022, according to company officials.

Holo, provider of the PureForm MicroAM process for high-volume production of fine-featured copper, stainless-steel and other alloy parts, attracted new investment from Lam Capital, Lam Research’s venture group, and Atreides Management, a long-term-oriented crossover fund, in this round, which also included participation from existing investors Prelude Ventures, Tao Capital Partners and Lightspeed Venture Partners.

Armed with the new funding, Holo reports efforts to double company size, accelerate development of its 3000-cm3/hr. high-throughput production system and continue expanding its materials portfolio. Toward that end and concurrent with this news, Holo reported the introduction of new copper and stainless alloys for PureForm MicroAM production.

Spun out of Autodesk in 2017, Holo was co-founded by the team who developed and led Autodesk’s Ember AM product, and has focused on lowering the barriers of AM adoption for volume production.

Industry-Related Terms: Alloys
View Glossary of Metalforming Terms


See also: Holo, Inc.



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